Wet Process Products for Bump

Wafer level packaging is rapidly growing within a wide range of microelectronic components. The main reasons are performance, design factors and application integration advantages.
While the advantages of flip chip application are immediately apparent for small components with highest PIN counts (ASICs and MPUs), this technology becomes more and more interesting for all PIN count products (like fast S-RAM) for performance reasons.
Less space required and improved performance . these are the drivers to replace the established wire bonding with flip chip interconnects on an increasingly large number of components.
 
Microetch chemistries combines cleaning action of the copper surface with a slight roughening & thin Cu strip. The copper surface is provided with a uniform, fine-grain etch.
The resulting finish ensures optimal bonding strength between the copper and the following layer.
 
Microetch chemistries is designed for the treatment of structured Wafer before using in the metalization & thin Cu strip.
The etching rate is only slight and more controllable in comparison with results achieved with simple etching.
 
  • Microetch series of pre- and post- treatment agent processes is designed for use with various metals.
        The ideal process is available for your needs.
  •  
    Copper microetch with adjustable etch rate
    Product
    Description
    Microetch CS 040 Mild acid etchant for Cu UBM
    Microetch CS 100 Acid etchant for Cu UBM
    Microetch CS 175
    High speed removal rate etchant for Cu UBM
     
    Copper microetch for fine pattern
    Product
    Description
    Microetch CS 040 Mild acid etchant for fine pattern Cu UBM
    Microetch CS 100 Acid etchant for fine pattern Cu UBM
    Microetch CS 175
    High speed removal rate etchant for fine pattern Cu UBM
     
    Nickel microetch with adjustable etch rate
    Product
    Description
    Microetch NS 070 Mild acid etchant for Ni UBM
    Microetch NS 090 High speed removal rate for Ni UBM
     
    Titan microetch with adjustable etch rate
    Product
    Description
    Microetch TS 070 Mild acid etchant for Ti UBM
    Microetch NS 090 High speed removal rate for Ti UBM
     
    Microetch for Au
    Product
    Description
    Microetch AUS 010 Mild acid etchant for Au UBM
    Microetch AUS 020 High speed removal rate for Au UBM
     
    Post CMP Cleaning
    Product
    Description
    Micro CC 050 Post cleaning for Cu CMP process