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Wet Process Products for Bump
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Wafer level packaging is rapidly growing within a wide
range of microelectronic components. The main reasons
are performance, design factors and application integration
advantages.
While the advantages of flip chip application are immediately
apparent for small components with highest PIN counts
(ASICs and MPUs), this technology becomes more and more
interesting for all PIN count products (like fast S-RAM)
for performance reasons.
Less space required and improved performance . these are
the drivers to replace the established wire bonding with
flip chip interconnects on an increasingly large number
of components. |
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Microetch chemistries combines cleaning action of the
copper surface with a slight roughening & thin Cu
strip. The copper surface is provided with a uniform,
fine-grain etch.
The resulting finish ensures optimal bonding strength
between the copper and the following layer. |
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Microetch chemistries is designed for the treatment
of structured Wafer before using in the metalization &
thin Cu strip.
The etching rate is only slight and more controllable
in comparison with results achieved with simple etching. |
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Microetch series of pre- and post- treatment agent
processes is designed for use with various metals.
The ideal process is available
for your needs.
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Copper microetch with adjustable
etch rate |
Product
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Description
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Microetch CS 040 |
Mild acid etchant for Cu UBM
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Microetch CS 100 |
Acid etchant for Cu UBM |
Microetch CS 175
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High speed removal rate etchant
for Cu UBM |
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Copper microetch for fine pattern |
Product
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Description
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Microetch CS 040 |
Mild acid etchant for fine pattern
Cu UBM |
Microetch CS 100 |
Acid etchant for fine pattern
Cu UBM |
Microetch CS 175
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High speed removal rate etchant
for fine pattern Cu UBM |
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Nickel microetch with adjustable
etch rate |
Product
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Description
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Microetch NS 070 |
Mild acid etchant for Ni UBM
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Microetch NS 090 |
High speed removal rate for
Ni UBM |
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Titan microetch with adjustable
etch rate |
Product
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Description
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Microetch TS 070 |
Mild acid etchant for Ti UBM
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Microetch NS 090 |
High speed removal rate for
Ti UBM |
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Microetch for Au |
Product
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Description
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Microetch AUS 010 |
Mild acid etchant for Au UBM
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Microetch AUS 020 |
High speed removal rate for
Au UBM |
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Post CMP Cleaning |
Product
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Description
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Micro CC 050 |
Post cleaning for Cu CMP process
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